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AMD Instinct MI455X

AMD's next-generation accelerator, built on CDNA 5 with 432 GB of HBM4 and deployed in the Helios rack of 72 GPUs and 18 EPYC CPUs. AMD says Helios begins shipping to customers in the second half of 2026.

AMD · Next generationShipping 2H 2026

MI455X

CDNA 5 · Helios rack

Memory
432 GB HBM4
Bandwidth
23.3 TB/s
Rack
72 GPUs · 18 CPUs

What has been announced

As published by AMD, checked 24 September 2026.

Form
Accelerator module, 4 GPUs per compute tray; Helios rack of 72 GPUs and 18 EPYC CPUs
Cooling
Direct liquid cooling
GPU memory
432 GB HBM4 per GPU; 31 TB per Helios rack
Memory bandwidth
23.3 TB/s per GPU
FP4 compute
40.3 PFLOPS MXFP4 per GPU (dense); up to 2.9 EFLOPS per Helios rack
Interconnect
UALink over Ethernet for scale-up at 3.6 TB/s per GPU; Ethernet scale-out at 600 GB/s per GPU
Power
Not published; AMD shares power data with qualified customers under NDA
Status
Launched July 2026; Helios shipments begin in the second half of 2026

Configuration and site considerations

The MI455X arrives as a liquid-cooled Helios rack, with delivery timing still ahead.

  • Plan for direct liquid cooling at rack scale.
  • AMD shares power data under NDA; confirm the site's power plan with the system builder.
  • Confirm the delivery schedule; shipments begin in the second half of 2026.

Prepare this system for a financing review

Document the configuration, the supplier and the deployment so the request can be assessed against the actual equipment.**

  • System configuration and quantity

  • Supplier and purchase order

    Or fleet details and ownership information for deployed servers.

  • Deployment site and colocation agreement

  • Power and cooling readiness

  • Customer contract or documented on-demand revenue

Bring the equipment plan to a financing conversation